Hyderabad, Telangana, IndiaFull Time3+ years experienceSalary not disclosed8 Apr 2026
MEMechanical Engineering
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Job Description
Company: Qualcomm India Private Limited Job Area: Engineering Group, Engineering Group > Mechanical Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all.
As a Qualcomm Mechanical Engineer, you will design, analyze, troubleshoot, and test electro-mechanical systems and packaging.
Qualcomm Engineers collaborate across functions to provide design information and complete project deliverables.
Qualifications
Bachelor's degree in Mechanical Engineering or related field.
Job Overview: We are seeking a Mechanical Engineer with strong hands‑on experience in mechanical design, 3D CAD modeling, and product development for mobile handset, IoT, and open test platform products.
The candidate will work closely with cross‑functional hardware and product teams to deliver robust, high‑quality designs that meet performance, cost, and schedule requirements.
The engineer will interface with internal teams as well as vendors in the fast-paced execution of a variety of multi-disciplined projects.
3+ years’ experience in mechanical design and product development 3+ years of proficiency in solid and surface modeling with 3D CAD tools like Creo with top‑down modeling experience Experience with electro-mechanical packaging for form factor designs, open test platforms, fixture design and testing procedures for volume testing.
Proven ability to work independently and collaboratively within a cross-functional team environment.
Packaged design experience utilizing Plastic Injection Molded parts, Die Cast, Sheet metal parts, machined parts.
Strong technical documentation skills and excellent written and verbal communication Preferred Qualifications Experience with hands‑on mechanical design using 3D CAD tools with expertise in Top‑Down solid modeling methodologies Develop mechanical designs based on strong fundamentals of mechanical engineering and analysis Define and manage design constraints, including Mech EMN file setup and transfer to CAD for board and FPC layout integration Experience in thermal and structural engineering analysis of high-density electronics packaging.
Experience with PDM systems for BOM and project management (Agile preferred) Specify and integrate appropriate mechanical components within form‑factor and packaging constraints Collaborate with RF, Baseband, Thermal, Analysis and Product Management teams to develop optimal design concepts Experience with product requirements such as vibration, shock, antenna performance, industrial design, safety, human factors, and cost.
Solid understanding of design, fabrication and procurement fundamentals for CNC, injection molded, die cast and stamped metal parts.
Prepare, conduct, and present design reviews to cross‑functional stakeholders Deliver clear status updates, presentations, and design documentation throughout the product lifecycle Effectively multitask and meet aggressive project schedules in a fast‑paced development environment Education.
Requirements
Bachelor of Mechanical Engineering required.
Keywords: Pro.
E, Creo, Circuit board, EMN, enclosure, simulation, analysis, optimization, mechanical design, CNC part design, Fixture design, Test platforms, Plastic Injection Molding, Sheetmetal design,, Agile, PDM, Die Cast, Electro Mechanical Packaging, Top Down, solid modelling, DC25, Design Constraints, FPC, LDS Applicants : Qualcomm is an equal opportunity employer.
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You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here.
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